CVE-2022-25664
Published: 19 October 2022
Summary
CVE-2022-25664 is a medium-severity Incomplete Cleanup (CWE-459) vulnerability in Qualcomm Apq8009 Firmware. Its CVSS base score is 6.2 (Medium).
Operationally, ranked at the 45.0th percentile by exploit likelihood (below the median); it is not currently listed in the CISA KEV catalog; a public proof-of-concept is referenced.
EU & UK References
- 🇪🇺 ENISA EUVD: EUVD-2022-30319
Vulnerability details
Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
- CWE(s)
Related Threats
No named actor attribution yet. ATT&CK technique mapping in progress for this CVE.
Affected Assets
Mitigating Controls
Likely Mitigating Controls AI
Per-CVE control mapping for this CVE has not run yet; the list below is derived from the weakness types (CWEs) cited in the NVD entry.
Mandates complete sanitization during cleanup so that shared resources (memory, caches, buffers) do not retain data across subjects.
Operational retention schedules mandate complete cleanup of temporary or residual sensitive data after use.
Termination of the non-persistent artifact guarantees cleanup of temporary state, directly countering incomplete cleanup weaknesses.
Fail-safe procedures can explicitly require cleanup of temporary state, resources, or privileges on failure to avoid leaving the system in an inconsistent state.
The explicit delete step when information is no longer needed implements the cleanup that this weakness omits.
Enforces complete cleanup and sanitization steps during disposal, closing gaps that leave data remnants on retired components.